本书介绍了两种典型电子产品汽车压力传感器和FPCB的制造工艺研究，分别对其关键制造工艺过程进行了多场多尺度建模分析，涵盖了分子动力学与有限元建模分析、工艺参数设计与优化、工艺性能实验验证。全书共10章，汇集了两种典型电子产品的关键工艺过程，包括铜-铜引线键合工艺中微观接触过程，六种典型材料引线键合工艺性能比较，汽车压力传感器灌封工艺中芯片残余应力分析，汽车压力传感器引线键合焊点的热循环失效分析，FPCB化锡工艺分子动力学研究，FPCB曝光工艺中光场分析，FPCB蚀刻工艺中蚀刻剂喷淋特性研究，FPCB蚀刻腔中蚀刻剂浓度分布与流场特性分析，FPCB蚀刻工艺中蚀刻腔几何形貌演化过程分析，FPCB多蚀刻腔蚀刻过程分析。本书针对MEMS和FPCB制造工艺中的实际问题，建立物理模型和数值模拟模型，基于有限元和分子动力学方法，模拟电子产品制造过程中材料、微观结构的演变，揭示加工过程中电子产品变形、应力、缺陷的形成机理与演化机制，在此基础上提出变形、应力与缺陷的抑制策略及调控理论，指导工艺优化，提高电子产品良率。

Chapter 1 Investigation on micro contact in Cu-Cu wire bonding process
1.1 Introduction
1.2 Molecular dynamics modeling of Cu-Cu wire bonding
1.3 Results and discussions
1.3.1 Formation and breakage processes of Cu-Cu weld
1.3.2 Analysis of Cu-Cu indentation morphology
1.3.3 Analysis of Cu-Cu atomic stress distribution
1.4 Conclusions
References
Chapter 2 Investigation on wire bonding performance with six typical material pairs
2.1 Introduction
2.2 Molecular dynamics modeling of six material pairs
2.3 Results and discussions
2.3.1 Analysis of bonding forces and system energy
2.3.2 Analysis of atomic morphology for six material pairs
2.3.3 Analysis of atomic stress distribution for six material pairs
2.3.4 Four critical displacement points of six material pairs
2.4 Conclusions
References
Chapter 3 Investigation on residual stress on chip of automobile pressure sensor in potting process
3.1 Introduction
3.2 Thermal experiment of MEMS pressure sensor
3.3 Analytic analysis of thermal stress on sensitive structure
3.4 Modeling and Simulation
3.4.1 Geometric model of MEMS pressure sensor
3.4.2 Finite element model of MEMS pressure sensor
3.4.3 Finite element simulation of residual stress
3.5 Conclusions
References
Chapter 4 Investigation on thermal cycle failure of wire bonding weld in automobile pressure sensor
4.1 Introduction
4.2 Thermal cycling experiments of the MEMS pressure sensor
4.2.1 A sample of thermal cycling test
4.2.2 Experimental methods of the thermal fatigue test
4.2.3 Experimental results and analysis under thermal cycles
4.3 Numerical simulation
4.3.1 Theoretical model of thermal fatigue
4.3.2 Geometric model of the MEMS pressure sensor
4.3.3 Simulation model of thermal fatigue of solder joint
4.3.4 Simulation results of solder joint failures
4.4 Conclusions
References
Chapter 5 Investigation on acoustic injection on automobile MEMS accelerometer
5.1 Introduction
5.2 Experimental investigation of acoustic injection
5.3 Modeling and simulation
5.3.1 Disassembly of inertial measurement unit (IMU)MPU6050
5.3.2 Geometric model of accelerometer unit
5.3.3 Finite element model of accelerometer sensitive structure
5.3.4 Simulation results and discussion of acoustic injection
5.4 Conclusions
References
Chapter 6 Investigation on wetting behavior of Sn droplet on FPCB substrate surfaces
6.1 Introduction
6.2 Models and methods of different surfaces
6.2.1 Modified embed atom method (MEAM) potential
6.2.2 Simulation models of different surfaces
6.2.3 Experimental procedures of wetting behavior on different surfaces
6.3 Results and discussion
6.3.1 Effect of temperature on wetting behavior
6.3.2 Effect of roughness on wetting behavior
6.3.3 Effect of Sn surface on wetting behavior
6.3.4 Contact angle measurement on different substrate surfaces
6.4 Conclusions
References
Chapter 7 Investigation on etchant spraying characteristics in FPCB etching process
7.1 Introduction
7.2 Equipment of the FPCB etching process
7.3 Numerical simulation of multi-nozzle spraying system
7.3.1 Governing equations of fluid dynamics
7.3.2 Simulation model of spraying equipment
7.4 Results and discussions
7.5 Conclusions
References
Chapter 8 Investigation of etchant concentration distribution and fluid characteristics in FPCB etching cavity
8.1 Introduction
8.2 Model formulation and method of etching process
8.2.1 Governing equations of fluid dynamics and mass flux
8.2.2 Simulation model of the FPCB etching cavity
8.3 Results and discussions
8.4 Conclusions
References
Chapter 9 Investigation of etching cavity evolution in FPCB etching process
9.1 Introduction
9.2 Equipment of the