Preface ⅩⅤ
Part Ⅰ
History of Electroless Plating
1. History–From the Discovery of Electroless Plating to the Present
1.1 Discovery of Electroless Plating
1.1.1 Early Works
1.1.2 Brenner and Riddell’s Work
1.2 Early Stage of Development （1940s–1959）
1.2.1 Research Works
1.2.2 Patents Issued
1.2.3 Preliminary Applications
1.3 Slow Growth of Period （1960–1979）
1.3.1 Improvement of the Plating Bath
1.3.2 Various Electroless Plating Metals
1.3.3 Electroless Plating Cu
1.3.4 Deposition Substrate
1.3.5 Application
1.4 Rapid Development of Period （1980–1999）
1.4.1 Studying the Nature of Electroless Plating
1.4.2 Studying the Properties of Electroless Plating Deposits
1.4.3 Large-Scale Application in Many Industries
1.4.4 Investigation of Ternary and Multicomponent Alloys and Composites
1.4.5 Electroless Plating Began and Developed Rapidly in China
1.4.6 Electroless Plating Fe–B Based Alloys Have Been Proposed and Developed
1.5 In-Depth Development and Nanoelectroless Plating Stage （2000–Present）
1.5.1 In-Depth Investigation of the Mechanism and Theory in Electroless Plating
1.5.2 Rapid Development of Nanoelectroless Plating
1.6 Summary and Prospect
References
Part Ⅱ
Technology of Electroless Plating-Plating Bath, Critical Parameters, Deposition Rate,and Stability of Plating Bath
2. Electroless Plating Baths of Metals, Binary Alloys,and Multicomponent Alloys
2.1 General Consideration for Electroless Plating Bath Solution
2.2 Plating Bath of Electroless Pure Nickel and Nickel-Based Binary Alloys
2.2.1 Pure Ni and Co Metals
2.2.2 Ni–P
2.2.3 Ni–B
2.3 Cobalt-Based Binary Alloys
2.3.1 Co–P
2.3.2 Co–B
2.4 Cu and Copper-Based Binary Alloys
2.5 Au
2.6 Ag
2.7 Pd and Palladium-Based Binary Alloys
2.8 Pt and Platinum-Based Binary Alloys
2.9 Ru, Rh, Os, and Cr–P Binary Alloys
2.10 Group B Metals （Zn, Cd, In, Sn, Pb, As, Sb, and Bi） and a Few Binary Alloys of these Metals
2.11 Electroless Plating of Ternary Alloys
2.11.1 Ni–Me–P Alloy Plating Baths
2.11.2 Co–Me–P Alloy Plating Baths
2.11.3 Ni–Me–B Alloy Plating Baths
2.11.4 Co–Me–B Alloy Plating Baths
2.11.5 Other Ternary Alloy Plating Baths
2.12 Electroless Plating of Quaternary Alloys
2.12.1 Ni-Based Quaternary Alloy Plating Baths
2.12.2 Co-Based Quaternary Alloy Plating Baths
2.13 Electroless Plating Quinary and Multialloys
2.14 Summary
References
3. Electroless Composite Plating
3.1 General Considerations about ECP
3.2 Bath Solutions of ECP
3.2.1 Bath for Binary Alloy-Based ECP
3.2.2 Bath for Ternary Alloy-Based ECP
3.2.3 Bath for ECP With Two Kinds of Particles
3.3 Summary
References
4. Nano Electroless Plating
4.1 Bulk Nano EP Materials
4.1.1 Nano ECP
4.1.2 EP Three-Dimensional Nanostructured Materials （3D NSMs）
4.2 2D Nano EP Materials
4.2.1 EP 2D Nano Films
4.2.2 EP 2D Nanoplates
4.2.3 EP 2D Nanodisks
4.2.4 EP 2D Nanoshells and Nanosheets
4.2.5 EP 2D Nanowalls
4.2.6 EP 2D Nano Circles and Rings
4.2.7 EP 2D Nanohoneycomb
4.2.8 EP 2D Nanoline, Nanofi n Pattern, and 2D Nano Grating
4.3 Linear （1D） Nano EP Materials
4.3.1 EP Nanotubes
4.3.2 EP Nanowires
4.3.3 EP Nanorods
4.3.4 EP Nanobelts
4.4 Zero-Dimensional Nano EP Materials
4.4.1 EP Nanoparticles
4.4.2 EP Nanoparticle Arrays
4.4.3 EP Nanoparticles Other Than Spherical Shape
4.4.4 EP Core-Shell Nanoparticles
4.5 Summary
References
5. Electroless Plating Fe-Based Alloys
5.1 Why Electroless Plating Fe–B Alloys？
5.2 Discovery of EP Fe–B Alloys
5.2.1 The Plating Bath and Affective Parameters
5.2.2 Analysis of the Diffi culty in Obtaining EP Fe–B Alloys
5.2.3 Composition, Structure, and Properties of EP Fe–B Alloys
5.2.4 Formation Mechanism of EP Fe–B Alloys
5.2.5 Problems and Worthwhile Improvements for EP Fe–B Alloys
5.3 EP Binary Fe–B Alloys
5.4 EP Fe–B-Based Multicomponent Alloys
5.4.1 EP Fe–W–B Alloy Deposits
5.4.2 EP Fe–Mo–B Alloy Deposits
5.4.3 EP Fe–Sn–B Alloy Deposits
5.4.4 EP Fe–W–Mo–B Alloy Deposits
5.4.5 EP Fe–Ni–B Alloy Deposits
5.5 EP Fe–P Alloys
5.6 EP Fe–P-Based Ternary-Component Alloys
5.7 Summary
References
6. Impact Parameters and Deposition Rate
6.1 Effects of Plating Bath Components on Deposition Rate
6.1.1 Effect of Metal Salts
6.1.2 Effect of Reducing Agent
6.1.3 The Effect of Complexing Agent
6.1.4 Effect of Stabilizer
6.1.5 Effect of Accelerating Agent
6.1.6 The Effect of Surfactants
6.2 Effects of Operating Conditions
6.2.1 Effect of pH Value
6.2.2 Effect of Plating Temperature
6.2.3 Effect of Plating Time
6.3 Effects of other Technological Parameters
6.3.1 Effect of Stirring
6.3.2 Effect of Magnetic Field
6.3.3 Effect of Bath Loading
6.4 Summary
References
7. Green Electroless Plating
7.1 What is Green Electroless Plating？
7.2 Green Electroless Plating of EN
7.3 Green Electroless Plating on Cu
7.3.1 Hypophosphite
7.3.2 Glyoxylic Acid
7.3.3 DMAB
7.3.4 Sodium Bisulfate
7.3.5 Co2+ and Fe2+
7.3.6 Saccharide
7.3.7 Green Ligand for EP Cu
7.4 Green Electroless Plating Ag
7.5 Green Electroless Plating Au
7.6 Summary
References
Part Ⅲ
Composition, Microscopic Structure,and Surface Morphology of Electroless Deposits
8. Composition and Microstructure
8.1 Composition and Microstructures of EP Alloy Deposits
8.1.1 Ni–P Alloy Deposits
8.1.2 Other EP Binary Deposits
8.1.3 Binary Alloy-Based ECP Deposits
8.2 Composition and Microstructures of EP Ternary and Multicomponent Alloy Deposits
8.2.1 Effects of Metal Salts on Composition and Structure in Ternary and Quaternary Alloy Coatings
8.2.2 Effects of Reductant on Composition and Structure in Ternary and Quaternary Alloy Coatings
8.2.3 Effects of Complexing Agents on Composition and Structure in Ternary and Quaternary Alloy Coatings
8.2.4 Effects of pH Value on Composition and Structure in Ternary and Quaternary Alloy Coatings
8.2.5 Effects of Temperature on Composition and Structure in Ternary and Quaternary Alloy Coatings
8.2.6 Infl uence of Ultrasound on Composition and Structure of EN Deposits
8.3 Crystallization of EP Amorphous Alloys
8.3.1 Crystallization Process and Products of EP Alloys Deposits
8.3.2 Crystallization Temperature and Activation Energy of EP Alloy Deposits
8.3.3 Crystallization Transformation Kinetics of EP Alloy Deposits
8.4 Summary
References
9. Surface Morphologies
9.1 Skeleton Understanding of Surface Morphologies of the EP Alloy Coatings
9.1.1 What Magnifi cation Can See the Morphology Clearly？
9.1.2 What Are the Morphological Features for Ni–P Based Alloy Deposits？
9.1.3 What is the Infl uence of Alloying Elements on the Surface Morphology of Ni–P Based Alloy Deposits？
9.1.4 Is there a Quantitative Relationship Between the Particle Size and Alloy Composition？
9.1.5 Should the Surface Morphology of Electroless Amorphous Coatings Be a Distinctive Pattern or Featureless？
9.2 The Effect of Alloying Elements on SEM
9.2.1 The Surface Morphology of EP Pure Metals
9.2.2 The Surface Morphology of EP Binary Alloy Films
9.2.3 The Surface Morphology of EP Multicomponent Alloy Films
9.3 Surface Morphology of ECP Alloy Deposits
9.4 Effects of Various Parameters on SEM
9.4.1 Effects of the Concentration of Metal Salts on SEM
9.4.2 Effects of Reductant on SEM
9.4.3 Effects of Complexing Agents on SEM
9.4.4 Effects of Stabilizers on SEM
9.4.5 Effects of Surfactants on SEM
9.4.6 Effects of pH Values on SEM
9.4.7 Effects of Plating Temperature on SEM
9.4.8 Effects of Plating Time on SEM
9.4.9 The Effects of Heat Treatment on SEM
9.5 Summary
References
Part Ⅳ
Kinetics, Mechanism, and Theory of Electroless Plating
10. Mechanism of Electroless Plating
10.1 The Existing Reaction Mechanism of EP Deposits
10.1.1 The So-Called Four Classical Mechanisms
10.1.2 Mixed Potential Theory
10.1.3 The Uniform Electrochemical Mechanism
10.2 Shortcomings and Defi ciencies of Existing Reaction Mechanisms of EP Deposits
10.3 Kinetics and Recent Progress
10.3.1 Real-Time Monitoring of Initial EP
10.3.2 Microstructure in Initial Stage of EP
10.3.3 Kinetics and Empirical Modeling of EP
10.4 Summary
References
11. Formation Theory and Formation Range of Electroless Amorphous Alloys
11.1 General Description of Formation of Electroless Amorphous Alloys
11.2 Formation Theory of Electroless Amorphous Alloys
11.2.1 A Brief Retrospect of the Quantitative Theory of Metallic Glass Formation
11.2.2 Formation Theory of Electroless Amorphous Alloy Systems
11.3 Formation Range of Electroless Amorphous Alloys: Experimental Facts and Theoretical Calculations
11.3.1 Experimental Data of RAF of EP Amorphous Alloys
11.3.2 Theoretical Calculation of RAF of EP Amorphous Alloys
11.4 Summary
References
12. Microscopic Theory of Electroless Plating
12.1 Why Use the Microscopic ab initio Theory to Investigate the EP Process？
12.2 Ab initio Computational Methods
12.2.1 Calculation Methods and Program Package
12.2.2 Selection of the Basis Sets
12.2.3 Selection of Oxidation Pathway
12.2.4 Solvation Effect
12.2.5 Catalytic Activity of Metal Surfaces
12.3 Theoretical Results Obtained by Ab Initio Methods
12.3.1 Reaction Mechanisms of EP Processes for Various Reductants
12.3.2 Detailed Investigation of Atomic Interaction Between Reductants and Metal Surfaces
12.3.3 The Role of Stabilizer and Plating Rate in EP
12.4 Summary and Prospective
References
Index