随着电子封装的发展，电子封装已从传统的四个主要功能（电源系统、信号分布及传递、散热与机械保护）扩展为六个功能，即增加了DFX及系统测试两个新的功能。其中DFX是为“X”而设计，X包括：可制造性、可靠性、可维护性、成本，甚至六西格玛。DFX有望在产品设计阶段实现工艺窗口的确定、可靠性评估和测试结构及参数的设计等功能，真正做到“第一次就能成功”，从而将计算机辅助工程（CAE）变为计算机主导工程（CE），以大大加速产品的上市速度。本书是全面介绍DFX在封装中应用的图书。作为封装工艺过程和快速可靠性评估及测试建模仿真的第一本专著，书中包含两位作者在工业界二十多年的丰富经验，以及在MEMS、IC和LED封装部分成功的实例，希望能给国内同行起到抛砖引玉的作用。同时，读者将会从书中的先进工程设计和微电子产品的并行工程和协同设计方法中受益。
本书第2版新增了两位作者在电子制造和封装领域新的成果与经验，例如电力电子模块的建模和仿真、电子封装耐热性的分析模型、3DTSV封装等内容。
本书主要读者对象为学习DFX（制造工艺设计、测试设计、可靠性设计等）的研究人员、工程师和学生等。

Foreword by Jianbin Luo
Foreword by C.P.Wong
Foreword by Zhigang Suo
Preface to Second Edition
Preface to First Edition
Acknowledgments
About the Authors
Part Ⅰ Mechanics and Modeling
1 Constitutive Models and Finite Element Method
1.1 Constitutive Models for Typical Materials
1.1.1 Linear Elasticity
1.1.2 Elastic-Visco-Plasticity
1.2 Finite Element Method
1.2.1 Basic Finite Element Equations
1.2.2 Nonlinear Solution Methods
1.2.3 Advanced Modeling Techniques in Finite Element Analysis
1.2.4 Finite Element Applications in Semiconductor Packaging Modeling
1.3 Chapter Summary
References
2 Material and Structural Testing for Small Samples
2.1 Material Testing for Solder Joints
2.1.1 Specimens
2.1.2 A Thermo-Mechanical Fatigue Tester
2.1.3 Tensile Test
2.1.4 Creep Test
2.1.5 Fatigue Test
2.2 Scale Effect of Packaging Materials
2.2.1 Specimens
2.2.2 Experimental Results and Discussions
2.2.3 Thin Film Scale Dependence for Polymer Thin Films
2.3 Two-Ball Joint Specimen Fatigue Testing
2.4 Chapter Summary
References
3 Constitutive and User-Supplied Subroutines for Solders Considering Damage Evolution
3.1 Constitutive Model for Tin-Lead Solder Joint
3.1.1 Model Formulation
3.1.2 Determination of Material Constants
3.1.3 Model Prediction
3.2 Visco-Elastic-Plastic Properties and Constitutive Modeling of Underfills
3.2.1 Constitutive Modeling of Underfills
3.2.2 Identification of Material Constants
3.2.3 Model Verification and Prediction
3.3 A Damage Coupling Framework of Unified Viscoplasticity for the Fatigue of Solder Alloys
3.3.1 Damage Coupling Thermodynamic Framework
3.3.2 Large Deformation Formulation
3.3.3 Identification of the Material Parameters
3.3.4 Creep Damage
3.4 User-Supplied Subroutines for Solders Considering Damage Evolution
3.4.1 Return-Mapping Algorithm and FEA Implementation
3.4.2 Advanced Features of the Implementation
3.4.3 Applications of the Methodol
3.5 Chapter Summary
References
4 Accelerated Fatigue Life Assessment Approaches for Solders in Packages
4.1 Life Prediction Methodology
4.1.1 Strain-Based Approach
4.1.2 Energy-Based Approach
4.1.3 Fracture Mechanics-Based Approach
4.2 Accelerated Testing Methodology
4.2.1 Failure Modes via Accelerated Testing Bounds
4.2.2 Isothermal Fatigue via Thermal Fatigue
4.3 Constitutive Modeling Methodology
4.3.1 Separated Modeling via Unified Modeling
4.3.2 Viscoplasticity with Damage Evolution
4.4 Solder Joint Reliability via FEA
4.4.1 Life Prediction of Ford Joint Specimen
4.4.2 Accelerated Testing: Insights from Life Prediction
4.4.3 Fatigue Life Prediction of a PQFP Package
4.5 Life Prediction of Flip-Chip Packages
4.5.1 Fatigue Life Prediction with and without Underfill
4.5.2 Life Prediction of Flip-Chips without Underfill via Unified and Separated Constitutive Modeling
4.5.3 Life Prediction of Flip-Chips under Accelerated Testing
4.6 Chapter Summary References
5 Multi-Physics and Multi-Scale Modeling
5.1 Multi-Phucicc Madalinaw w
5.1.1 Direct-Coupled Analysis
5.1.2 Sequential Coupling
5.2 Multi-Scale Modeling
5.3 Chapter Summary
References
……
Part Ⅱ Modeling in Microelectronic Packaging and Assembly
Part Ⅲ Modeling in Microelectronic Package and Integration: Reliability and Test
Part Ⅳ Modern Modeling and Simulation Methodologies: Application to Nano Packaging
Appendix Conversion Tables and Constants