本书系统介绍了超摩尔时代先进封装理论模型、分析与新的模拟结果。内容涉及2．5D、3D、晶圆级封装的电性能、热性能、热机械性能、散热问题、可靠性问题、电气串扰等问题，提出了基于多孔介质体积平均理论的建模方法并应用于日渐复杂的先进封装结构，以及模型验证、设计和测试，并从原理到应用对封装热传输进行了很好的介绍。同时，引入并分析了碳纳米管、金刚石镀层、石墨烯等新材料的应用性能。本书针对产品开发阶段封装的热管理年11应力管理方面进行了详细阐述，在封装性能测试、蒸汽层散热器、微槽道冷却、热电制冷等方面也有涉及。相应的试验测试和案例分析也便于读者提高对封装}生能表征和评估方法的理解。
本书可作为从事微电子封装行业人员的参考资料，也可供高等院校相关专业研究生和高年级本科生学习参考。

张恒运，上海工程技术大学教授，博士生导师，IEEE高级会员。曾任职于新加坡微电子研究院，美国超微半导体公司（新加坡）、美国道康宁公司（上海）。主持和参与新加坡先进科技局、美国DARPA、上海科委、自然科学基金、跨国公司项目近20项，发表论文80多篇，GOOGLE Scholar引用率1000次。授予美国、新加坡发明专利和中国发明、实用新型专利共30多项。

Preface
Acknowledgments
About the authors
1 Introduction
1.1 Evolution of integrated circuit packaging
1.2 Performance and design methodology for integrated circuit packaging
References
Further reading
2 Electrical modeling and design
2.1 Fundamental theory
2.2 Modeling, characterization, and design of through-silicon via packages
References
3 Thermal modeling, analysis, and design
3.1 Principles of thermal analysis and design
3.2 Package-level thermal analysis and design
3.3 Numerical modeling
3.4 Package-level thermal enhancement
3.5 Air cooling for electronic devices with vapor chamber configurations
3.6 Liquid cooling for electronic devices
3.7 Thermoelectric cooling
References
4 Stress and reliability analysis for interconnects
4.1 Fundamental of mechanical properties
4.2 Reliability test and analysis methods
4.3 Case study of design-for-reliability
References
5 Reliability and failure analysis of encapsulated packages
5.1 Typical integrated circuit packaging failure modes
5.2 Heat transfer and moisture diffusion in plastics integrated circuit packages
5.3 Thermal- and moisture-induced stress analysis
5.4 Fracture mechanics analysis in integrated circuits package
5.5 Reliability enhancement in PBGA package
References
Further reading
6 Thermal and mechanical tests for packages and materials
6.1 Package them叫tests
6.2 Material mechanical test and characterization
References
7 System-level modeling, analysis, and design
7.1 System-level them叫modeling and design
7.2 Mechanical modeling and design for microcooler system
7.3 Codesign modeling and analysis for advanced packages
References
Appendix 1 Nomenclature
Appendix 2 Conversion factors
Index