Chapter 1 Introduction
1.1 Increasing Challenges in Advanced Cooling
1.2 Water Cooling and New Alternatives
1.3 Basic Features of Conventional Heat Exchangers
1.3.1 Heat Exchanger Classification by Geometry and Structure
1.3.2 Heat Exchange Enhancement Techniques
1.4 Limitations of Waterbased Heat Exchanger
1.4.1 Overall Properties of Water
1.4.2 Adhesion and Cohesion
1.4.3 Surface Tension
1.4.4 Specific Heat
1.4.5 Conductivity
1.5 Liquid Metal Coolant for Chip Cooling
1.6 Some Facts about Liquid Metal
1.7 Revisit of Traditional Liquid Metal Cooling
1.8 Liquid Metal Enabled Innovation on Conventional Heat Exchanger
1.9 Potential Application Areas of Liquid Metal Thermal Management
1.9.1 Chip Cooling
1.9.2 Heat Recovery
1.9.3 Energy System
1.9.4 Heat Transfer Process Engineering
1.9.5 Aerospace Exploration
1.9.6 Appliances in Large Power Systems
1.9.7 Thermal Interface Material
1.9.8 More New Conceptual Applications
1.10 Technical and Scientific Challenges in Liquid Metal Heat Transfer
1.11 Conclusion
References
Chapter 2 Typical Liquid Metal Medium and Properties for Advanced Cooling
2.1 Typical Properties of Liquid Metals
2.1.1 Low Melting Point
2.1.2 Thermal Conductivity
2.1.3 Surface Tension
2.1.4 Heat Capacity
2.1.5 Boiling Temperature
2.1.6 Subcooling Point
2.1.7 Viscosity
2.1.8 Electrical Properties
2.1.9 Magnetic Properties
2.1.10 Chemical Properties
2.2 Alloy Candidates with Low Melting Point
2.2.1 Overview
2.2.2 GaIn Alloy
2.2.3 NaK Alloy
2.2.4 Woods Metal
2.3 Nano Liquid Metal as More Conductive Coolant or Grease
2.3.1 Technical Concept of Nano Liquid Metal
2.3.2 Performance of Typical Nano Liquid Metals
2.4 Liquid Metal Genome towards New Material Discovery
2.4.1 About Liquid Metal Material Genome
2.4.2 Urgent Needs on New Liquid Metals
2.4.3 Category of Room Temperature Liquid Metal Genome
2.5 Fundamental Routes toward Finding New Liquid Metal Materials
2.5.1 Alloying Strategy from Single Metal Element
2.5.2 Making Composite from Binary Liquid Alloys
2.5.3 Realizing Composite from Multicomponent Liquid Alloys
2.5.4 Nano Technological Strategies
2.5.5 Additional Physical Approaches
2.5.6 Chemical Strategies
2.6 Fundamental Theories for Material Discovery
2.6.1 Calculation of Phase Diagram （CALPHAD）
2.6.2 First Principle Prediction
2.6.3 Molecular Dynamics Simulation
2.6.4 Other Theoretical Methods
2.7 Experimental Ways for Material Discovery
2.8 Theoretical and Technical Challenges
2.9 Conclusion
References
Chapter 3 Fabrications and Characterizations of Liquid Metal Cooling Materials
Chapter 5 Nano Liquid Metal towards Making Enhanced Materials
Chapter 6 Liquid Metal-based Thermal Interface Material
Chapter 7 Low Melting Point Metal Enabled Phase Change Cooling
Chapter 8 Fluidic Properties of Liquid Metal
Chapter 9 Liquid Metal Flow Cooling and Its Applications in Diverse Areas
Chapter 10 Self-adaptable Liquid Metal Cooling
Chapter 11 Liquid Metal Cooling in Small Space
Chapter 12 Hybrid Cooling via Liquid Metal and Aqueous Solution
Chapter 13 Liquid Metal for the Harvesting of Heat and Energy
chapter 14 combinatorial Liguid Metal Het Transter towards Extreme Cooling
Appendix
Index

随着微纳电子技术的飞速发展，高集成度芯片、光电器件与系统等引发的热障问题，已成为制约其可持续发展的关键瓶颈。本书作者于2002年前后首次在芯片冷却领域引入了液态金属散热技术，随后在国内外引发重大反响和后续大量研究，成为近年来该领域内前沿热点和极具应用前景的重大发展方向之一。为推动这一新兴学科领域的可持续健康发展，本书系统阐述液态金属先进散热技术的基本原理及实际应用，并剖析了相应主题上若干可供探索的途径和新方向。本书为英文版，可作为走出去项目（已通过国际部向国外出版社推荐），具有极高的原创性和权威性。