随着无线通信的日益频繁，射频电路设计的重要性也日渐提高。无线电通信设备是拥有蓝牙、Wi—Fi、WiMAX和ZigBee等各种协议的无线通信产业的支柱。几乎所有移动通信设备部有射频组成部分，而本书则以实用的方式讲解了如何设计和集成这部分电路。

本书第一版写于1982年并多次重印，是一本经典的射频电路书籍。新版加强了无线技术方面的阐述，新增了关于射频前端设计与射频设计工具的两章内容，还包含了集成电路和系统级设计方面的内容。书中包括许多详细的设计实例，非常适合有一定电路基础的初学者作为实践指南。

全书包括了导线、电阻等的基础知识，谐振电路，滤波器设计，阻抗匹配，射频晶体管，小信号射频放大器，射频前端电路，射频设计工具等设计概念和工具。

本书第一版写于1982年并多次重印，是一本经典的射频电路书籍。新版本加强了无线技术方面的阐述，新增了关于射频前端设计与射频设计工具的两章内容，还包含了集成电路和系统级设计方面的内容。全书内容包括电路元件、谐振电路、滤波器设计、阻抗匹配、射频晶体管、小信号射频放大器设计、射频（大信号）功率放大器设计、射频前端电路设计和射频软件工具等。该书内容精炼，深入浅出，书中包括许多详细的设计实例，非常适合有一定电路基础的初学者作为实践指南。

本书适合射频与微波技术工程师、无线通信工程技术人员和通信网技术人员阅读，也可供相关科研工作者及工程技术人员参考。

Chapter 1 Components and Systems

 1.1 WIRE

1.1.1 Skin Effect

1.1.2 Straight-Wire Inductors

 1.2 RESISTORS

1.2.1 Resistor Equivalent Circuit

 1.3 CAPACITORS

1.3.1 Parallel-Plate Capacitor

1.3.2 Real-World Capacitors

1.3.3 Capacitor Types

 1.4 INDUCTORS

1.4.1 Real-World Inductors

1.4.2 Single-Layer Air-Core Inductor Design

1.4.3 Magnetic-Core Materials

 1.5 TOROIDS

1.5.1 Core Characteristics

1.5.2 Powdered Iron vs. Ferrite

 1.6 TOROIDAL INDUCTOR DESIGN

 1.7 PRACTICAL WINDING HINTS

Chapter 2 Resonant Circuits

 2.1 SOME DEFINITIONS

 2.2 RESONANCE（LOSSLESS COMPONENTS）

 2.3 LOADED Q

2.3.1 Effect of Rs and RL on the Loaded Q

2.3.2 The Effect of Component Q on Loaded Q

 2.4 INSERTION LOSS

 2.5 IMPEDANCE TRANSFORMATION

 2.6 COUPLING OF RESONANT CIRCUITS

2.6.1 Capacitive Coupling

2.6.2 Inductive Coupling

2.6.3 Active Coupling

 2.7 SUMMARY

Chapter 3 Filter Design

 3.1 BACKGROUND

 3.2 MODERN FILTER DESIGN

 3.3 NORMALIZATION AND THE LOW-PASS PROTOTYPE

 3.4 FILTER TYPES

3.4.1 The Butterworth Response

3.4.2 The Chebyshev Response

3.4.3 The Bessel Filter

 3.5 FREQUENCY AND IMPEDANCE SCALING

 3.6 HIGH-PASS FILTER DESIGN

 3.7 THE DUAL NETWORK

 3.8 BANDPASS FILTER DESIGN

 3.9 SUMMARY OF THE BANDPASS FILTER DESIGN PROCEDURE

 3.10 BAND-REJECTION FILTER DESIGN

 3.11 THE EFFECTS OF FINITE Q

Chapter 4 Impedance Matching

 4.1 BACKGROUND

 4.2 THE L NETWORK

 4.3 DEALING WITH COMPLEX LOADS

 4.4 THREE-ELEMENT MATCHING

4.4.1 The Pi Network

4.4.2 The T network

 4.5 LOW-Q OR WlDEBAND MATCHING NETWORKS

 4.6 THE SMITH CHART

4.6.1 Smith Chart Construction

4.6.2 Basic Smith Chart Tips

4.6.3 Plotting Impedance Values

4.6.4 Impedance Manipulation on the Chart

4.6.5 Conversion of Impedance to Admittance

4.6.6 Admittance Manipulation on the Chart

 4.7 IMPEDANCE MATCHING ON THE SMITH CHART

4.7.1 Two-Element Matching

4.7.2 Three-Element Matching

4.7.3 Multi-Element Matching

 4.8 SOFTWARE DESIGN TOOLS

4.8.1 Smith Chart Tools

4.8.2 Integrated Design Tools

 4.9 SUMMARY

Chapter 5 The Transistor at Radio Frequencies

 5.1 RF TRANSISTOR MATERIALS

 5.2 THE TRANSISTOR EQUIVALENT CIRCUIT

5.2.1 Input Impedance

5.2.2 Output Impedance

5.2.3 Feedback Characteristics

5.2.4 Gain

5.2.5 Transistor as a Switch

5.2.6 MEMs as a Switch

 5.3 Y PARAMETERS

5.3.1 The Transistor as a Two-Port Network

5.3.2 Two-Port Y Parameters

 5.4 S PARAMETERS

5.4.1 Transmission Line Background

5.4.2 S Parameters and the Two-Port Network

 5.5 UNDERSTANDING RF TRANSISTOR DATA SHEETS

 5.6 SUMMARY

Chapter 6 Small-Signal RF Amplifier Design

 6.1 SOME DEFINITIONS

 6.2 TRANSISTOR BIASING

 6.3 DESIGN USING Y PARAMETERS

6.3.1 Stability Calculations

6.3.2 Maximum Available Gain

6.3.3 Simultaneous Conjugate Matching（Unconditionally Stable Transistors）

6.3.4 Transducer gain

6.3.5 Designing with Potentially Unstable Transistors

 6.4 DESIGN USING S PARAMETERS

6.4.1 Stability

6.4.2 Maximum Available Gain

6.4.3 Simultaneous Conjugate Match（Unconditionally Stable Transistors）

6.4.4 Transducer Gain

6.4.5 Design for a Specified Gain

6.4.6 Stability Circles

6.4.7 Design for Optimum Noise Figure

6.4.8 Design Example

Chapter 7 RF（Large Signal）Power Amplifiers

 7.1 RF POWER TRANSISTOR CHARACTERISTICS

7.1.1 The RF Power Transistor Data Sheet

 7.2 TRANSISTOR BIASING

7.2.1 Class-A Amplifiers and Linearity

7.2.2 Class-B Power Amplifiers

7.2.3 Class-C Power Amplifiers

 7.3 RF SEMICONDUCTOR DEVICES

7.3.1 Monolithic Microwave Integrated Circuits（MMIC）

 7.4 POWER AMPLIFIER DESIGN

7.4.1 Optimum Collector Load Resistance

7.4.2 Driver Amplifiers and Interstage Matching

 7.5 MATCHING TO COAXIAL FEEDLINES

 7.6 AUTOMATIC SHUTDOWN CIRCUITRY

 7.7 BROADBAND TRANSFORMERS

7.7.1 Power Splitters

7.7.2 Power Combiners

 7.8 PRACTICAL WINDING HINTS

 7.9 SUMMARY

Chapter 8 RF Front-End Design

 8.1 HIGHER LEVELS OF INTEGRATION

 8.2 BASIC RECEIVER ARCHITECTURES

8.2.1 AM Detector Receivers

8.2.2 TRF Receiver

8.2.3 Direct-Conversion Receiver

8.2.4 Superheterodyne Receivers

8.2.5 Front-End Amplifiers

8.2.6 Selectivity

 8.3 ADC'S EFFECT ON FRONT-END DESIGN

 8.4 SOFTWARE DEFINED RADIOS

 8.5 CASE STUDY—MODERN COMMUNICATION RECEIVER

8.5.1 IF Amplifier Design

Chapter 9 RF Design Tools

 9.1 DESIGN TOOL BASICS

 9.2 DESIGN LANGUAGES

9.2.1 Verilog

9.2.2 Verilog-AMS

9.2.3 Verilog-A

9.2.4 SystemVerilog

9.2.5 VHDL

9.2.6 VHDL-AMS

9.2.7 VHDL-AMS/FD

9.2.8 VHDL-RF/MW

9.2.9 C/C++

9.2.10 SystemC

9.2.11 MATLAB/RF Toolbox/Simulink

9.2.12 SPICE

 9.3 RFIC DESIGN FLOW

9.3.1 System Design

9.3.2 Circuit Design

9.3.3 Circuit Layout

9.3.4 Parasitic Extraction

9.3.5 Full-Chip Verification

 9.4 RFIC DESIGN FLOW EXAMPLE

9.4.1 HDL Multi-Level Simulation

9.4.2 Block Circuit Design

9.4.3 Physical Implementation

9.4.4 Parasitic Extraction

9.4.5 Calibrated Models

 9.5 SIMULATION EXAMPLE 1

 9.6 SIMULATION EXAMPLE 2

 9.7 MODELING

9.7.1 Modeling Issues

 9.8 PCB DESIGN

9.8.1 The Flow

9.8.2 PCB Design Tools

 9.9 PACKAGING

9.9.1 Options

9.9.2 Design Solutions

 9.10 CASE STUDY

9.10.1 System-Level Transceiver Design

9.10.2 Circuit-Level Receiver Design

9.10.3 LNA Design

9.10.4 Device Characterization

9.10.5 Circuit Design

9.10.6 Down-Converter Circuit Design

9.10.7 Transmitter Circuit Design

9.10.8 Up-Converter Design

9.10.9 Mixer Design

9.10.10 PA Design

9.10.11 PA Device Characterization

9.10.12 PA Circuit Design

 9.11 SUMMARY

Appendix A RF and Antennas

Appendix B Vector Algebra

Bibliography