本书是微纳技术著作丛书(影印版)之一,涵盖了CMOS化学微传感系统的各个领域,详细论述了化学微传感器在CMOS中的集成技术。内容丰富,涵盖了大量的基础知识及CM()S技术中化学微传感器的相关重要信息,适合希望从事此领域工作的学生、工程技术人员、科学家阅读,对于熟悉本领域的专家也很有参考价值。
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书名 | CMOS技术中的集成化学微传感系统(影印版)/微纳技术著作丛书 |
分类 | 科学技术-工业科技-电子通讯 |
作者 | (美)海尔莱曼 |
出版社 | 科学出版社 |
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简介 | 编辑推荐 本书是微纳技术著作丛书(影印版)之一,涵盖了CMOS化学微传感系统的各个领域,详细论述了化学微传感器在CMOS中的集成技术。内容丰富,涵盖了大量的基础知识及CM()S技术中化学微传感器的相关重要信息,适合希望从事此领域工作的学生、工程技术人员、科学家阅读,对于熟悉本领域的专家也很有参考价值。 内容推荐 本书涵盖了CMOS化学微传感系统的各个领域,详细论述了化学微传感器在CMOS中的集成技术。在做了简要介绍之后,阐述了所有必备的基础知识,介绍了各种化学敏感方法,并介绍了CM~)S技术及其在微、传感器中的应用,最后对未来的发展作出了展望。 本书内容丰富,涵盖了大量的基础知识及CM()S技术中化学微传感器的相关重要信息,适合希望从事此领域工作的学生、工程技术人员、科学家阅读,对于熟悉本领域的专家也很有参考价值。 目录 Preface 1 Introduction 2 Fundamentals of Chemical Sensing 3 Microtechnology for Chemical Sensors 3.1 Microtechnology Substrate Materials 3.2 Fundamental Semiconductor Processing Steps 3.2.1 Deposition 3.2.2 Patterning 3.2.3 Etching 3.2.4 Doping. 3.3 CMOS Technology 3.4 Microfabrication for Chemical Sensors 3.4.1 Micromachining for Chemical Microsensors 3.4.1.1 Bulk Micromachining 3.4.1.2 Surface Micromachining 3.4.2 Wafer Bonding 3.4.3 Sensitive-Layer Deposition 4 Microfabricated Chemical Sensors 4.1 Chemomechanical Sensors 4.1.1 Rayleigh SAW Devices 4.1.2 Flexural-Plate-Wave or Lamb-Wave Devices 4.1.3 Resonating Cantilevers 4.2 Thermal Sensors 4.2.1 Catalytic Thermal Sensors (Pellistors) 4.2.2 Thermoelectric or Seebeck-Effect Sensors 4.3 Optical Sensors 4.3.1 Integrated Optics 4.3.2 Microspectrometers 4.3.2.1 Fabry-Perot-Type Structures 4.3.2.2 Grating-Type Structures 4.3.3 Bioluminescent Bioreporter Integrated Circuits (BBIC) 4.3.4 Surface Plasmon Resonance (SPR) Devices 4.4 Electrochemical Sensors 4.4.1 Voltammetric Sensors 4.4.2 Potentiometric Sensors 4.4.2.1 Electrochemical Cell 4.4.2.2 Field-Effect-Based Devices 4.4.2.2.1 MOS Field-Effect Transistors, MOSFETS, and Ion-Selective Field- Effect Transistors, ISFETs (Chemotransistors) 4.4.2.2.2 MOS Diode and Ion-Controlled Diode, ICD (Chemodiodes) 4.4.2.2.3 MOS Capacitor and Ion-Selective Capacitor (Chemocapacitors) 4.4.2.2.4 Measuring Work Functions: Kelvin Probe and Suspended-Gate Field-Effect Transistor, SGFET 4.4.2.2.5 Light-Addressable Potentiometric Sensor, LAPS 4.4.2.2.6 Field-Effect Device Fabrication 4.4.3 Conductometric Sensors 4.4.3.1 Chemoresistors 4.4.3.1.1 Low-Temperature Chemoresistors 4.4.3.1.2 High-Temperature Chemoresistors (Hotplate Sensors) 4.4.3.2 Chemocapacitors 5 CMOS Platform Technology for Chemical Sensors 5.1 CMOS Capacitive Microsystems 5.1.1 CMOS Capacitive Transducer 5.1.2 On-Chip Circuitry of the Capacitive Microsystem 5.1.3 Capacitive Gas Sensing 5.1.3.1 Selectivity Through Sensitive Layer Thickness 5.1.3.2 Insensitivity to Low-E Analytes 5,1.3.3 Humidity Interference 5.2 CMOS Calorimetric Device 5.2.1 CMOS Calorimetric Transducer 5.2.2 Calorimeter Circuitry 5.2.3 Calorimetric Gas Sensing 5.3 CMOS Integrated Resonant Cantilever 5.3.1 Resonant Cantilever Transducers 5.3.1.1 Thermal Actuation 5.3.1.2 Magnetic Actuation 5.3.1.3 Vibration Detection 5.3.1.4 Cantilever Temperature 5.3.2 Microcantilever Circuitry 5.3.2.1 Thermal Actuation 5.3.2.2 Magnetic Actuation 5.3.3 Microcantilevers as Chemical Sensors 5.3.3.1 Polymer Coating 5.3.3.2 Analyte Absorption 5.3.4 Comparison of Cantilevers to Other Mass-Sensitive Devices 5.4 CMOS Microhotplate System Development 5.4.1 CMOS Microhotplates 5.4.1.1 Temperature Sensor Calibration 5.4.1.2 Thermal Microhotplate Modeling and Characterization 5.4.1.3 Microhotplate Heaters: Resistor and Transistor 5.4.1.4 Microhotplate Sensor Fabrication 5.4.2 Hotplate-Based CMOS Monolithic Microsystems 5.4.2.1 Analog Hotplate Microsystem 5.4.2.2 Analog/Digital Hotplate Microsystem 5.4.2.3 Digital Hotptate Array Microsystem 5.5 CMOS Chemical Multisensor Systems 5.5.1 CMOS Multiparameter Biochemical Microsystem 5.5.2 CMOS Gas-Phase Multisensor System 5.5.2.1 Multisystem Architecture 5.5.2.2 Multisystem Circuitry Components, Design and Fabrication 5.5.2.3 Multisystem Gas Sensor Measurements 5.5.2.4 Multisystem Applications and Operation Modes 5.6 CMOS Chemical Microsensor and System Packaging 5.6.1 Simple Epoxy-Based Package 5.6.2 Chip-on-Board Package 5.6.3 Flip-Chip Package , 6 Outlook and Future Developments References Abbreviations Index |
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